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Electrical Package Characterization
 Amkor's Electrical Characterization Lab offers a complete, accurate, high frequency package characterization service. Amkor uses a variety of high-frequency EDA tools, such as the HP85240A Picosecond Interconnect Modeling Suite, and HP Advanced Design System used in conjunction with a 20 GHz Network analyzer and micro-probes, to provide a solution for the electrical problems before building expensive prototypes, thus speeding time to market. For additional information, click here.
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ChipArray® Package
Amkor’s ChipArray® packages are offered in laminate format and are available as BGA. The near-chip-size standard outlines offer fixed body sizes and ball counts up to 500. Due to its small size and I/O density, Amkor’s ChipArray product family is an excellent choice for new devices requiring a small footprint size and low mounted height. Click here for additional information.
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Game, Memory and I/O Cards (AmKard®)
Amkor offers memory card assembly and test services in various formats; MMC, RS-MMC, MMCmicro, SD, mini-SD, MicroSD, xD Picture, Memory Stick, DUO, USB memory modules, etc. Amkor’s fully molded (1x mold) structure using AmKard® Technology is the lowest cost memory card available and we have the protfolio of technologies to enable the most cost effective full turnkey memory card solution. Click here for additional information.
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