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What's New - 120 Days

JUNE 2008

06/19/2008 The VisionPak® LCC Image Sensor Data Sheet has been updated.
06/19/2008 The CMOS Image Sensor Camera Module Data Sheet has been updated.
06/18/2008 The FCMBGA Data Sheet has been posted.
06/18/2008 The White Paper: "Molded Flip Chip - FCMBGA” Presented at the IMAPS International Conference and Exhibition on Device Packaging March 17-20, 2008 Scottsdale, Arizona has been posted.
06/18/2008 The "Introducing FCMBGA (Flip Chip Molded BGA) Amkor’s Evolutionary Packaging Technology" Advertorial has been posted.
06/18/2008 The "Introducing FCMBGA: Amkor’s Breakthrough Packaging Technology" Advertisement has been posted.
06/18/2008 The Flip Chip Technology Solutions Sheet has been updated.
06/18/2008 The SuperFC® Data Sheet has been updated.
06/05/2008 The Common Platform section has been posted.
06/04/2008 The MEMS / MOEMS Technology Solution Sheet has been updated.
06/04/2008 Amkor will be exhibiting in the Common Platform booth at the upcoming DAC 2008 Convention. Monday June 9th - Thursday June 12th Anaheim Convention Center Booth: 628

MAY 2008

05/22/2008 The Multi-Chip (MCP) & Stacked-Die Leadframe Packages Data Sheet has been updated.
05/22/2008 The Amkor Technology Investor Presentation has been posted.

APRIL 2008

04/16/2008 The Amkor "Introducing FusionQuad™: Amkor’s Breakthrough Packaging Technology." Advertisement has been posted.
04/16/2008 The Amkor Technology 2007 Annual Report has been posted.
04/16/2008 The Charter for the Audit Committee of the Board of Directors of Amkor Technology has been updated.
04/04/2008 The Amkor Technology Corporate Brochure has been updated.
04/03/2008 The Application Notes for Preliminary Surface Mount for FusionQuad™ Package has been updated.

MARCH 2008

03/26/2008 The Application Notes for Preliminary Surface Mount for FusionQuad™ Package has been updated.
03/18/2008 The CSPnl™ Wafer Level Package Data Sheet has been updated.
03/18/2008 The CSPnl™ Bump on Pad (BOP) Wafer Level Package Data Sheet has been updated.
03/18/2008 The CSPnl™ Bump on Repassivation / Redistribution Wafer Level Package Data Sheet has been updated.
03/18/2008 The article, "Package-on-package (PoP) with Through-mold Vias” By Christopher Scanlan, Amkor Technology has been posted.
03/17/2008 The Application Notes for Preliminary Surface Mount for FusionQuad™ Package has been updated.
03/17/2008 The Amkor Technology Philippines, Inc. ISO 9001 (ATP - P1-P2) Factory Certification has been posted.
03/17/2008 The Amkor Technology Philippines, Inc. ISO 9001 (ATP - P3-P4) Factory Certification has been posted.
03/17/2008 The Amkor Technology Korea, Inc. ISO 9001 (ATK - K1) Factory Certification has been posted.
03/17/2008 The Amkor Technology Korea, Inc. ISO 9001 (ATK - K3) Factory Certification has been posted.
03/17/2008 The Amkor Technology Korea, Inc. ISO 9001 (ATK - K4) Factory Certification has been posted.
03/17/2008 The Amkor Technology Philippines, Inc. TS 16949 (ATP - P1-P2) Factory Certification has been posted.
03/17/2008 The Amkor Technology Philippines, Inc. TS 16949 (ATP -P3-P4) Factory Certification has been posted.
03/17/2008 The Amkor Technology Korea, Inc. TS 16949 (ATK - K1) Factory Certification has been posted.
03/17/2008 The Amkor Technology Korea, Inc. TS 16949 (ATK - K3) Factory Certification has been posted.
03/17/2008 The Amkor Technology Korea, Inc. TS 16949 (ATK - K4) Factory Certification has been posted.
03/07/2008 The Application Notes for Preliminary Surface Mount for FusionQuad™ Package has been posted.
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