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 Amkor’s FusionQuad™ represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad™ QFP and MLF® technologies. FusionQuad™ is based upon the addition of exposed bottom lands within a standard VQFP package format. The novel integration of bottom lands provides a cost-effective platform for increased lead count in a small form factor. FusionQuad™ not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50% reduction in package size for a given leadcount. Additionally, FusionQuad™ provides excellent RF electrical performance characteristics with short signal paths to the bottom lands and high power dissipation capability with the solderable exposed die attach paddle.
System architects, IC designers and packaging engineers will find that FusionQuad™ offers a unique blend of excellent electrical and thermal performance in a miniaturized cost-effective leadframe plastic package. Applications requiring increased data rates or RF communications will benefit from the low insertion loss up to 10 Gigahertz when utilizing the bottom lands for high speed signals. The 0.8mm package thickness allows FusionQuad™ to be applied to end products requiring thin profiles such as mobile hard disk drives, notebook computers and other consumer electronics. The unique footprint of FusionQuad™ allows for the use of low cost printed circuit boards in the end application due to the space available for coarse routing vias between the bottom lands and the outer peripheral leads.
Applications:
Amkor’s FusionQuad™ provides an ideal package format for most IC semiconductor
technologies including advanced mixed signal SoCs, motor drivers, MCUs, ASICs,
DSPs and a variety of others. FusionQuad™ is particularly well suited for applications requiring superior electrical
or thermal performance in a cost constrained environment including hard disk
drives, laptop PCs, Ethernet communication, digital television, data conversion and
many others.
Amkor’s FusionQuad™ VQFP IC package portfolio provides these features:
- 10 x 10 mm to 24 x 24 mm body sizes
- Increased I/O (100 to 376) in smaller package footprints
- Copper leadframe based
- Integrated exposed die attach
- 0.8 mm body thickness (0.9 mm maximum stand off height)
- Pb Free / Green
- Flexible designs for optimal electrical and thermal performance
Electrical:
Simulated results @ 100 MHz.
| Lead |
Pad Size (mm) |
Body Size Pkg (mm) |
LO |
(nH) |
(pF) |
(m ) |
| 176 ld |
6.5 x 6.5 |
14 x 14 |
Longest |
5.99 |
0.82 |
209 |
| 176 ld |
6.5 x 6.5 |
14 x 14 |
Shortest |
1.42 |
0.23 |
81 |
Thermal Resistance:
JEDEC (1S2P) Standard Test Boards (Non-Thermally Optimized) Tested @ 1 W
Theta JA (°C/W) by Velocity (m/s)
| Pkg |
Body Size (mm) |
Exposed Pad (mm) |
0 |
1.0 |
2.5 |
| 176 ld |
14 x 14 |
6.5 x 6.5 |
25.8 |
20.8 |
18.8 |
Reliability:
IC chips are assembled in optimized package designs with proven reliable
semiconductor materials.
| Moisture Sensitivity Caracterization: |
JEDEC Level 3, 30°C / 60% RH, 192 hours |
| Temp / Humidity: |
85°C / 85% RH, 1000 hours |
| PCT: |
121°C, 2 atm, 100%RH, 504 hours |
| High temp storage: |
150°C, 1000 hours |
| Temp cycle: |
-65 / +150°C, 1000 cycles |
Process Highlights:
| Die Thickness: |
10.0 ± .5 mils |
| Strip Solder Plating: |
Matte Sn or NiPdAu |
| Strip Marking: |
Laser |
| Lead Inspection : |
Laser / Optical |
| Pack / Ship Options: |
Bar Code, Dry Pack |
| Wafer Backgrinding: |
Laser |
Test Services:
- Program generation / conversion
- Product engineering support
- Available test / handling technology
- Wafer sort
- Burn-in capabilities
Shipping:
- JEDEC outline CS-007 low profile tray.
FusionQuad™ Package Options (custom lead configurations available):
Body Size
(mm) |
Total
Lead Count |
External Leads
(0.5mm pitch)
|
Internal
Leads |
Max Die
Size (mm) |
Max Pad
Size (mm) |
10 x 10 |
100 |
64 |
36 |
4.0 |
5.0 |
12 x 12 |
132 |
80 |
52 |
6.0 |
7.0 |
14 x 14 |
164 |
100 |
64 |
8.0 |
9.0 |
16 x 16 |
204 |
120 |
84 |
9.5 |
11.0 |
20 x 20 |
256 |
144 |
112 |
13.5 |
15.0 |
24 x 24 |
288 |
176 |
112 |
13.5 |
15.0 |
Body Size
(mm) |
Total
Lead Count |
External Leads
(0.5mm pitch)
|
Internal
Leads |
Max Die
Size (mm) |
Max Pad
Size (mm) |
10 x 10 |
116 |
64 |
52 |
3.0 |
4.0 |
12 x 12 |
156 |
80 |
73 |
5.0 |
6.0 |
14 x 14 |
216 |
100 |
116 |
7.0 |
8.0 |
16 x 16 |
260 |
120 |
140 |
8.5 |
10.0 |
20 x 20 |
344 |
144 |
200 |
12.5 |
14.0 |
24 x 24 |
376 |
176 |
200 |
12.5 |
14.0 |
Note: Portfolio based on theoretical calculations - designs not complete for all options. All data on this data sheet is preliminary.
Additional Information:
| Description |
File Type |
File Size |
| FusionQuad™ Data Sheet |
|
319 kb
|
| FusionQuad™ Test Contactor Data Sheet |
|
123 kb
|
| White Paper: "FusionQuad™: Novel Leadframe Based Package Provides Performance Boost for Hard Disk Drive Data Transfer Performance” |
|
182 kb
|
| Application Notes for Preliminary Surface Mount for FusionQuad Package |
|
549 kb
|
| MicroLeadFrame® Data Sheet |
|
203 kb
|
| ExposedPad™ LQFP / TQFP Data Sheet |
|
559 kb |
For more information on the FusionQuad™ package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form. |
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