Leading the Industry in Outsourcing Semiconductor Assembly and Test
Digital cameras. Cell phones. Network servers. Laptops. Video games. MP3 players.
When Amkor Technology was founded in 1968, many of the products that we take for granted today existed only in the mind's eye of visionaries.
Amkor helped make these visions a reality by pioneering the outsourcing of semiconductor assembly and test services. Today, Amkor is a strategic contract manufacturing resource for many of the world's leading semiconductor companies. We have developed unique expertise in high-volume manufacturing techniques and have diversified and expanded our operational scope by establishing production centers in strategic locations throughout Asia.
Amkor provides leading-edge package solutions such as Stacked Packaging, Flip Chip, MicroLeadFrame®, System-in-Package, MEMS, Wafer Level Packaging (WLP), CMOS Image Sensor Camera Modules, and Game, Memory and I/O Cards (AmkKard®) for latest generation applications.
Amkor supplements its world-class operational scope with the industry's
- Largest package design staff
- Broadest portfolio of packaging technology
- Deepest sales and support organization
As integrated circuits increase in speed and complexity, the right semiconductor packaging becomes critical to ensure optimal system performance. Amkor is an industry leader in tailoring application-specific package design, assembly and test solutions.
Amkor offers the industry's broadest array of package formats and sizes, from traditional, "off-the-shelf" leadframe configurations to leading-edge chip scale, flip chip and system-in-package solutions incorporating highly customized designs. This allows Amkor to be a single source for many of our customers' total IC packaging requirements.
We also provide a complete range of test engineering services for RF, mixed signal, logic and memory devices, from test program development to full product characterization. Amkor is a major provider of RF test services and is the world leader in Strip Test, an innovative, highly parallel test solution that offers customers low cost, faster index time and improved test yields.
Collaboration: Speeding Time-to-Revenue
With Amkor providing turnkey solutions that include semiconductor design, packaging, test and drop-shipment services, our customers can get accelerate time-to-revenue for their new products.
Amkor collaborates with customers and leading OEMs to develop comprehensive package solutions that make it easier for next-generation semiconductors to be designed into next-generation end products. By sharing device, package and product roadmaps we enable our customers - and their customers - to accelerate the development and deployment of new microelectronic applications.
Focusing on our core competencies allows our customers to optimize their assets and reduce time-to-sales.
The Industry's Broadest Reach
Amkor has more than five million square feet of manufacturing space in factories strategically located in key microelectronic manufacturing centers throughout Asia. Our customers benefit from the industry's most extensive operational footprint, which enables us to easily handle large orders and quick turnaround times. All manufacturing sites worldwide are working towards, or have received certification to QS-9000, ISO-9001, ISO-9002, ISO-14001, ISO-14000, IECQ, and DSCC / QML.
Amkor factories are strategically located in the heart of Asia's microelectronic manufacturing centers such as China, Japan, Korea, Philippines, and Taiwan.
Amkor Technology Videos
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Additional Information:
| Description |
File Type |
File Size |
| Amkor Technology Corporate Brochure |
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636 kb |
Amkor Technology Corporate Brochure
(Japanese Translation) |
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803 kb |
| Amkor Technology Corporate Fact Sheet |
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336 kb |
Amkor Sales, Factory and Customer Service
Contact Information Directory |
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38 kb |
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