Amkor Lowers Second Quarter 2008 Sales Guidance Amkor Technology to Announce Second Quarter 2008 Financial Results on August 5, 2008 Amkor Announces New Flip Chip Packaging Technology at SEMICON West 2008 Amkor to Present at JP Morgan Technology Conference Ken Joyce Named President of Amkor Technology Amkor Reports First Quarter 2008 Results Wafer Level Packaging Service Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP products. Amkor’s CSPnl™ has been widely adopted as the industry standard for cost effective, reliable, high performance wafer level CSP applications. It is available in three options: Direct Bump on Pad (BOP), Bump on Repassivation / Redistribution and Bump on Thick Repassivation / Redistribution. Click here for additional information. Flip Chip Interconnect Technology Solutions Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology (ie: SuperFC®, fcCSP, fcBGA, fcLBGA, Ceramic fcBGA). Flip Chip production capability exists in our Philippines, Korea, Taiwan and China factories. Wafer Bumping, Wafer Level Packaging (WLP), and Flip Chip packaging solutions are qualified in lead-free options. Click here for additional information. TSSOP Package With the evolution of smaller, denser, faster and lighter end products, it became necessary for IC packages to be affordably manufacturable. Amkor not only shrunk the SOP by decreasing the lead pitch, but made it thin, - 0.9 mm thin with 8 to 80 lead counts! Amkor invested time and research into assuring quality and reliability with advanced designs, assembly equipment / processes and materials. Click here for additional information.