Amkor News Center
AMKOR ANNOUNCES THE NEW FCMBGA!
 Amkor Technology, Inc’s FCMBGA is the evolution of the SuperFC® high performance flip chip solution. The FCMBGA packaging process has been simplified from the SuperFC® process by eliminating the capillary underfill process (CUF) and utilizing a molded underfill (MUF).
There are several advantages that can be realized as a result of this transition. These include a simplified process flow, reduced body size, improved electrical performance, improved reliability, and better warpage control.
By eliminating CUF from the package construction process, keep-out areas required for CUF are eliminated. As a result, FCMBGA allows reduced body size and improved board real estate use, by allowing closer spacing between passives and the flip chip die.
One of the more substantial benefits of the new process is better electrical performance. The improvement is due to the ability to move passive components (such as capacitors) closer to the flip chip die. This benefit also makes FCMBGA well-suited for multi-chip packages with high levels of integration.
Warpage control is another key improvement driven by the MUF process. Increased electrical requirements are pushing substrate technology into thinner cores while increased I/O density is driving larger substrate sizes. Warpage control for thin, large substrates is challenging. FCMBGA provides a more rigid structure for thin core substrates. This allows for better final package coplanarity. FCMBGA also extends the die size range for bare die packages, which typically need a stiffener and/or lid to meet JEDEC coplanarity requirements.
As IC fabrication nodes continue to decrease in size, fabrication layers become more fragile. Traditional CUF packages are reaching reliability limits. FCMBGA allows the use of MUF materials where historically CUF materials were required. MUFs are higher filler content and lower moisture absorption than CUFs. Coupled with finer filler particles these materials will allow FCBGA packaging for ultra low k nodes.
FCMBGA is produced in an exposed die configuration. Advanced molding techniques coupled with next generation mold compounds are used to produce FCMBGA. The exposed die configuration not only maintains the excellent thermal performance of bare die FCBGA, but it enhances as well, by providing a support surface around the die for direct heat sink attach. For small to medium die sizes, 8-14mm, FCMBGA provides excellent coplanarity without the need for a stiffener/lid or formed lid configurations. For larger die sizes, FCMBGA offers the flexibility of attaching a lid. This provides transparency for SuperFC® customers.
The flexibility of this new IC packaging technology makes it applicable to a wide array of devices including ASIC / FPGA, GPU and CPUs. FCMBGA provides the package solution for networking and storage, gaming, broadband communications, computer, multimedia markets, etc.
The combined impact of the benefits mentioned here would suggest that FCMBGA will have a significant impact on packaging technology in the years to come.
Visit us at SEMICON West 2008, Booth 7352,
West Hall, Level 1, to learn more about FCMBGA. |
